Polycrystalline dielectric coating for cobalt iron alloy thin films

ABSTRACT

In one general embodiment, a method includes performing a reducing operation for reducing a native oxide along a surface of a CoFe layer of a magnetic transducer, after performing the reducing operation, performing an oxidation operation for oxidizing the surface of the CoFe layer, and after performing the oxidation operation, forming a layer of at least partially crystalline alumina on the oxidized surface of the CoFe layer.

This is a division of application Ser. No. 15/156,035 filed May 16,2016, now U.S. Pat. No. 9,837,103.

BACKGROUND

The present invention relates to data storage systems, and moreparticularly, this invention relates to a polycrystalline dielectriccoating for cobalt iron alloy thin films useable with magnetic heads.

In magnetic storage systems, magnetic transducers read data from andwrite data onto magnetic recording media. Data is written on themagnetic recording media by moving a magnetic recording transducer to aposition over the media where the data is to be stored. The magneticrecording transducer then generates a magnetic field, which encodes thedata into the magnetic media. Data is read from the media by similarlypositioning the magnetic read transducer and then sensing the magneticfield of the magnetic media. Read and write operations may beindependently synchronized with the movement of the media to ensure thatthe data can be read from and written to the desired location on themedia.

An important and continuing goal in the data storage industry is that ofincreasing the density of data stored on a medium. For tape storagesystems, that goal has led to increasing the track and linear bitdensity on recording tape, and decreasing the thickness of the magnetictape medium. However, the development of small footprint, higherperformance tape drive systems has created various problems in thedesign of a tape head assembly for use in such systems.

In a tape drive system, the drive moves the magnetic tape over thesurface of the tape head at high speed. Usually the tape head isdesigned to minimize the spacing between the head and the tape. Thespacing between the magnetic head and the magnetic tape is crucial andso goals in these systems are to have the recording gaps of thetransducers, which are the source of the magnetic recording flux in nearcontact with the tape to effect writing sharp transitions, and to havethe read elements in near contact with the tape to provide effectivecoupling of the magnetic field from the tape to the read elements.

SUMMARY

A method according to one embodiment includes performing a reducingoperation for reducing a native oxide along a surface of a CoFe layer ofa magnetic transducer, after performing the reducing operation,performing an oxidation operation for oxidizing the surface of the CoFelayer, and after performing the oxidation operation, forming a layer ofat least partially crystalline alumina on the oxidized surface of theCoFe layer.

Other aspects and embodiments of the present invention will becomeapparent from the following detailed description, which, when taken inconjunction with the drawings, illustrate by way of example theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram of a simplified tape drive systemaccording to one embodiment.

FIG. 1B is a schematic diagram of a tape cartridge according to oneembodiment.

FIG. 2 illustrates a side view of a flat-lapped, bi-directional,two-module magnetic tape head according to one embodiment.

FIG. 2A is a tape bearing surface view taken from Line 2A of FIG. 2.

FIG. 2B is a detailed view taken from Circle 2B of FIG. 2A.

FIG. 2C is a detailed view of a partial tape bearing surface of a pairof modules.

FIG. 3 is a partial tape bearing surface view of a magnetic head havinga write-read-write configuration.

FIG. 4 is a partial tape bearing surface view of a magnetic head havinga read-write-read configuration.

FIG. 5 is a side view of a magnetic tape head with three modulesaccording to one embodiment where the modules all generally lie alongabout parallel planes.

FIG. 6 is a side view of a magnetic tape head with three modules in atangent (angled) configuration.

FIG. 7 is a side view of a magnetic tape head with three modules in anoverwrap configuration.

FIG. 8A is a partial cross sectional view of a magnetic head accordingto one embodiment.

FIG. 8B is a detailed view taken from Circle 8B of FIG. 8A.

FIG. 9 is a flow diagram of a process according to one embodiment.

FIG. 10A is a magnified view of amorphous Co oxide and Fe oxide at aCoFe surface of a comparative example.

FIG. 10B is a magnified view of a portion of FIG. 10A.

FIG. 10C is an electron energy loss spectroscopy (EELS) scan across thelayer interface shown in FIGS. 10A and 10B.

FIG. 11A is a magnified view of a comparative example.

FIG. 11B is a magnified view of a portion of FIG. 11A.

FIG. 11C is an electron energy loss spectroscopy (EELS) scan across thelayer interface shown in FIGS. 11A and 11B.

FIG. 12A is a magnified view of an embodiment of the present invention.

FIG. 12B is a magnified view of a portion of FIG. 12A.

FIG. 12C is an electron energy loss spectroscopy (EELS) scan across thelayer interface shown in FIGS. 12A and 12B.

FIG. 13A is a Transmission Electron Microscopy (TEM) image of anembodiment of the present invention.

FIG. 13B is a diffractogram of the structure shown in FIG. 13A.

DETAILED DESCRIPTION

The following description is made for the purpose of illustrating thegeneral principles of the present invention and is not meant to limitthe inventive concepts claimed herein. Further, particular featuresdescribed herein can be used in combination with other describedfeatures in each of the various possible combinations and permutations.

Unless otherwise specifically defined herein, all terms are to be giventheir broadest possible interpretation including meanings implied fromthe specification as well as meanings understood by those skilled in theart and/or as defined in dictionaries, treatises, etc.

It must also be noted that, as used in the specification and theappended claims, the singular forms “a,” “an” and “the” include pluralreferents unless otherwise specified.

The following description discloses several preferred embodiments ofmagnetic storage systems, as well as operation and/or component partsthereof.

In one general embodiment, an apparatus includes a magnetic transducerhaving a CoFe layer and an at least partially polycrystallinealumina-containing coating on a media facing side of the CoFe layer. Agraded layer comprising Co, Fe, Al and oxygen is positioned between thealumina-containing coating and the CoFe layer, wherein a ratio of Co toAl in the graded layer decreases from the CoFe layer toward thealumina-containing coating.

In another general embodiment, an apparatus includes a magnetictransducer having a CoFe layer and an at least partially polycrystallinealumina-containing coating on a media facing side of the CoFe layer.CoFe-oxide crystallites are present at an interface region of the CoFelayer and the alumina-containing coating and the CoFe layer.

In yet another general embodiment, a method includes performing areducing operation for reducing a native oxide along a surface of a CoFelayer of a magnetic transducer. After performing the reducing operation,an oxidation operation for oxidizing the surface of the CoFe layer isperformed. After performing the oxidation operation, a layer of at leastpartially crystalline alumina is formed on the oxidized surface of theCoFe layer.

FIG. 1A illustrates a simplified tape drive 100 of a tape-based datastorage system, which may be employed in the context of the presentinvention. While one specific implementation of a tape drive is shown inFIG. 1A, it should be noted that the embodiments described herein may beimplemented in the context of any type of tape drive system.

As shown, a tape supply cartridge 120 and a take-up reel 121 areprovided to support a tape 122. One or more of the reels may form partof a removable cartridge and are not necessarily part of the system 100.The tape drive, such as that illustrated in FIG. 1A, may further includedrive motor(s) to drive the tape supply cartridge 120 and the take-upreel 121 to move the tape 122 over a tape head 126 of any type. Suchhead may include an array of readers, writers, or both.

Guides 125 guide the tape 122 across the tape head 126. Such tape head126 is in turn coupled to a controller 128 via a cable 130. Thecontroller 128, may be or include a processor and/or any logic forcontrolling any subsystem of the drive 100. For example, the controller128 typically controls head functions such as servo following, datawriting, data reading, etc. The controller 128 may include at least oneservo channel and at least one data channel, each of which include dataflow processing logic configured to process and/or store information tobe written to and/or read from the tape 122. The controller 128 mayoperate under logic known in the art, as well as any logic disclosedherein, and thus may be considered as a processor for any of thedescriptions of tape drives included herein, in various embodiments. Thecontroller 128 may be coupled to a memory 136 of any known type, whichmay store instructions executable by the controller 128. Moreover, thecontroller 128 may be configured and/or programmable to perform orcontrol some or all of the methodology presented herein. Thus, thecontroller 128 may be considered to be configured to perform variousoperations by way of logic programmed into one or more chips, modules,and/or blocks; software, firmware, and/or other instructions beingavailable to one or more processors; etc., and combinations thereof.

The cable 130 may include read/write circuits to transmit data to thehead 126 to be recorded on the tape 122 and to receive data read by thehead 126 from the tape 122. An actuator 132 controls position of thehead 126 relative to the tape 122.

An interface 134 may also be provided for communication between the tapedrive 100 and a host (internal or external) to send and receive the dataand for controlling the operation of the tape drive 100 andcommunicating the status of the tape drive 100 to the host, all as willbe understood by those of skill in the art.

FIG. 1B illustrates an exemplary tape cartridge 150 according to oneembodiment. Such tape cartridge 150 may be used with a system such asthat shown in FIG. 1A. As shown, the tape cartridge 150 includes ahousing 152, a tape 122 in the housing 152, and a nonvolatile memory 156coupled to the housing 152. In some approaches, the nonvolatile memory156 may be embedded inside the housing 152, as shown in FIG. 1B. In moreapproaches, the nonvolatile memory 156 may be attached to the inside oroutside of the housing 152 without modification of the housing 152. Forexample, the nonvolatile memory may be embedded in a self-adhesive label154. In one preferred embodiment, the nonvolatile memory 156 may be aFlash memory device, ROM device, etc., embedded into or coupled to theinside or outside of the tape cartridge 150. The nonvolatile memory isaccessible by the tape drive and the tape operating software (the driversoftware), and/or other device.

By way of example, FIG. 2 illustrates a side view of a flat-lapped,bi-directional, two-module magnetic tape head 200 which may beimplemented in the context of the present invention. As shown, the headincludes a pair of bases 202, each equipped with a module 204, and fixedat a small angle α with respect to each other. The bases may be“U-beams” that are adhesively coupled together. Each module 204 includesa substrate 204A and a closure 204B with a thin film portion, commonlyreferred to as a “gap” in which the readers and/or writers 206 areformed. In use, a tape 208 is moved over the modules 204 along a media(tape) bearing surface 209 in the manner shown for reading and writingdata on the tape 208 using the readers and writers. The wrap angle θ ofthe tape 208 at edges going onto and exiting the flat media supportsurfaces 209 are usually between about 0.1 degree and about 3 degrees.

The substrates 204A are typically constructed of a wear resistantmaterial, such as a ceramic. The closures 204B may be made of the sameor similar ceramic as the substrates 204A.

The readers and writers may be arranged in a piggyback or mergedconfiguration. An illustrative piggybacked configuration comprises a(magnetically inductive) writer transducer on top of (or below) a(magnetically shielded) reader transducer (e.g., a magnetoresistivereader, etc.), wherein the poles of the writer and the shields of thereader are generally separated. An illustrative merged configurationcomprises one reader shield in the same physical layer as one writerpole (hence, “merged”). The readers and writers may also be arranged inan interleaved configuration. Alternatively, each array of channels maybe readers or writers only. Any of these arrays may contain one or moreservo track readers for reading servo data on the medium.

FIG. 2A illustrates the tape bearing surface 209 of one of the modules204 taken from Line 2A of FIG. 2. A representative tape 208 is shown indashed lines. The module 204 is preferably long enough to be able tosupport the tape as the head steps between data bands.

In this example, the tape 208 includes 4 to 32 data bands, e.g., with 16data bands and 17 servo tracks 210, as shown in FIG. 2A on a one-halfinch wide tape 208. The data bands are defined between servo tracks 210.Each data band may include a number of data tracks, for example 1024data tracks (not shown). During read/write operations, the readersand/or writers 206 are positioned to specific track positions within oneof the data bands. Outer readers, sometimes called servo readers, readthe servo tracks 210. The servo signals are in turn used to keep thereaders and/or writers 206 aligned with a particular set of tracksduring the read/write operations.

FIG. 2B depicts a plurality of readers and/or writers 206 formed in agap 218 on the module 204 in Circle 2B of FIG. 2A. As shown, the arrayof readers and writers 206 includes, for example, 16 writers 214, 16readers 216 and two servo readers 212, though the number of elements mayvary. Illustrative embodiments include 8, 16, 32, 40, and 64 activereaders and/or writers 206 per array, and alternatively interleaveddesigns having odd numbers of reader or writers such as 17, 25, 33, etc.An illustrative embodiment includes 32 readers per array and/or 32writers per array, where the actual number of transducer elements couldbe greater, e.g., 33, 34, etc. This allows the tape to travel moreslowly, thereby reducing speed-induced tracking and mechanicaldifficulties and/or execute fewer “wraps” to fill or read the tape.While the readers and writers may be arranged in a piggybackconfiguration as shown in FIG. 2B, the readers 216 and writers 214 mayalso be arranged in an interleaved configuration. Alternatively, eacharray of readers and/or writers 206 may be readers or writers only, andthe arrays may contain one or more servo readers 212. As noted byconsidering FIGS. 2 and 2A-B together, each module 204 may include acomplementary set of readers and/or writers 206 for such things asbi-directional reading and writing, read-while-write capability,backward compatibility, etc.

FIG. 2C shows a partial tape bearing surface view of complementarymodules of a magnetic tape head 200 according to one embodiment. In thisembodiment, each module has a plurality of read/write (R/W) pairs in apiggyback configuration formed on a common substrate 204A and anoptional electrically insulative layer 236. The writers, exemplified bythe write transducer 214 and the readers, exemplified by the readtransducer 216, are aligned parallel to an intended direction of travelof a tape medium thereacross to form an R/W pair, exemplified by the R/Wpair 222. Note that the intended direction of tape travel is sometimesreferred to herein as the direction of tape travel, and such terms maybe used interchangeably. Such direction of tape travel may be inferredfrom the design of the system, e.g., by examining the guides; observingthe actual direction of tape travel relative to the reference point;etc. Moreover, in a system operable for bi-direction reading and/orwriting, the direction of tape travel in both directions is typicallyparallel and thus both directions may be considered equivalent to eachother.

Several R/W pairs 222 may be present, such as 8, 16, 32 pairs, etc. TheR/W pairs 222 as shown are linearly aligned in a direction generallyperpendicular to a direction of tape travel thereacross. However, thepairs may also be aligned diagonally, etc. Servo readers 212 arepositioned on the outside of the array of R/W pairs, the function ofwhich is well known.

Generally, the magnetic tape medium moves in either a forward or reversedirection as indicated by arrow 220. The magnetic tape medium and headassembly 200 operate in a transducing relationship in the mannerwell-known in the art. The piggybacked MR head assembly 200 includes twothin-film modules 224 and 226 of generally identical construction.

Modules 224 and 226 are joined together with a space present betweenclosures 204B thereof (partially shown) to form a single physical unitto provide read-while-write capability by activating the writer of theleading module and reader of the trailing module aligned with the writerof the leading module parallel to the direction of tape travel relativethereto. When a module 224, 226 of a piggyback head 200 is constructed,layers are formed in the gap 218 created above an electricallyconductive substrate 204A (partially shown), e.g., of AlTiC, ingenerally the following order for the R/W pairs 222: an insulating layer236, a first shield 232 typically of an iron alloy such as NiFe (—),cobalt zirconium tantalum (CZT) or Al—Fe—Si (Sendust), a sensor 234 forsensing a data track on a magnetic medium, a second shield 238 typicallyof a nickel-iron alloy (e.g., ˜80/20 at % NiFe, also known aspermalloy), first and second writer pole tips 228, 230, and a coil (notshown). The sensor may be of any known type, including those based onMR, GMR, AMR, tunneling magnetoresistance (TMR), etc.

The first and second writer poles 228, 230 may be fabricated from highmagnetic moment materials such as ˜45/55 NiFe. Note that these materialsare provided by way of example only, and other materials may be used.Additional layers such as insulation between the shields and/or poletips and an insulation layer surrounding the sensor may be present.Illustrative materials for the insulation include alumina and otheroxides, insulative polymers, etc.

The configuration of the tape head 126 according to one embodimentincludes multiple modules, preferably three or more. In awrite-read-write (W-R-W) head, outer modules for writing flank one ormore inner modules for reading. Referring to FIG. 3, depicting a W-R-Wconfiguration, the outer modules 252, 256 each include one or morearrays of writers 260. The inner module 254 of FIG. 3 includes one ormore arrays of readers 258 in a similar configuration. Variations of amulti-module head include a R-W-R head (FIG. 4), a R-R-W head, a W-W-Rhead, etc. In yet other variations, one or more of the modules may haveread/write pairs of transducers. Moreover, more than three modules maybe present. In further approaches, two outer modules may flank two ormore inner modules, e.g., in a W-R-R-W, a R-W-W-R arrangement, etc. Forsimplicity, a W-R-W head is used primarily herein to exemplifyembodiments of the present invention. One skilled in the art apprisedwith the teachings herein will appreciate how permutations of thepresent invention would apply to configurations other than a W-R-Wconfiguration.

FIG. 5 illustrates a magnetic head 126 according to one embodiment ofthe present invention that includes first, second and third modules 302,304, 306 each having a tape bearing surface 308, 310, 312 respectively,which may be flat, contoured, etc. Note that while the term “tapebearing surface” appears to imply that the surface facing the tape 315is in physical contact with the tape bearing surface, this is notnecessarily the case. Rather, only a portion of the tape may be incontact with the tape bearing surface, constantly or intermittently,with other portions of the tape riding (or “flying”) above the tapebearing surface on a layer of air, sometimes referred to as an “airbearing”. The first module 302 will be referred to as the “leading”module as it is the first module encountered by the tape in a threemodule design for tape moving in the indicated direction. The thirdmodule 306 will be referred to as the “trailing” module. The trailingmodule follows the middle module and is the last module seen by the tapein a three module design. The leading and trailing modules 302, 306 arereferred to collectively as outer modules. Also note that the outermodules 302, 306 will alternate as leading modules, depending on thedirection of travel of the tape 315.

In one embodiment, the tape bearing surfaces 308, 310, 312 of the first,second and third modules 302, 304, 306 lie on about parallel planes(which is meant to include parallel and nearly parallel planes, e.g.,between parallel and tangential as in FIG. 6), and the tape bearingsurface 310 of the second module 304 is above the tape bearing surfaces308, 312 of the first and third modules 302, 306. As described below,this has the effect of creating the desired wrap angle α₂ of the taperelative to the tape bearing surface 310 of the second module 304.

Where the tape bearing surfaces 308, 310, 312 lie along parallel ornearly parallel yet offset planes, intuitively, the tape should peel offof the tape bearing surface 308 of the leading module 302. However, thevacuum created by the skiving edge 318 of the leading module 302 hasbeen found by experimentation to be sufficient to keep the tape adheredto the tape bearing surface 308 of the leading module 302. The trailingedge 320 of the leading module 302 (the end from which the tape leavesthe leading module 302) is the approximate reference point which definesthe wrap angle α₂ over the tape bearing surface 310 of the second module304. The tape stays in close proximity to the tape bearing surface untilclose to the trailing edge 320 of the leading module 302. Accordingly,read and/or write elements 322 may be located near the trailing edges ofthe outer modules 302, 306. These embodiments are particularly adaptedfor write-read-write applications.

A benefit of this and other embodiments described herein is that,because the outer modules 302, 306 are fixed at a determined offset fromthe second module 304, the inner wrap angle α₂ is fixed when the modules302, 304, 306 are coupled together or are otherwise fixed into a head.The inner wrap angle α₂ is approximately tan⁻¹(δ/W) where δ is theheight difference between the planes of the tape bearing surfaces 308,310 and W is the width between the opposing ends of the tape bearingsurfaces 308, 310. An illustrative inner wrap angle α₂ is in a range ofabout 0.3° to about 1.1°, though can be any angle required by thedesign.

Beneficially, the inner wrap angle α₂ on the side of the module 304receiving the tape (leading edge) will be larger than the inner wrapangle α₃ on the trailing edge, as the tape 315 rides above the trailingmodule 306. This difference is generally beneficial as a smaller α₃tends to oppose what has heretofore been a steeper exiting effectivewrap angle.

Note that the tape bearing surfaces 308, 312 of the outer modules 302,306 are positioned to achieve a negative wrap angle at the trailing edge320 of the leading module 302. This is generally beneficial in helpingto reduce friction due to contact with the trailing edge 320, providedthat proper consideration is given to the location of the crowbar regionthat forms in the tape where it peels off the head. This negative wrapangle also reduces flutter and scrubbing damage to the elements on theleading module 302. Further, at the trailing module 306, the tape 315flies over the tape bearing surface 312 so there is virtually no wear onthe elements when tape is moving in this direction. Particularly, thetape 315 entrains air and so will not significantly ride on the tapebearing surface 312 of the third module 306 (some contact may occur).This is permissible, because the leading module 302 is writing while thetrailing module 306 is idle.

Writing and reading functions are performed by different modules at anygiven time. In one embodiment, the second module 304 includes aplurality of data and optional servo readers 331 and no writers. Thefirst and third modules 302, 306 include a plurality of writers 322 andno data readers, with the exception that the outer modules 302, 306 mayinclude optional servo readers. The servo readers may be used toposition the head during reading and/or writing operations. The servoreader(s) on each module are typically located towards the end of thearray of readers or writers.

By having only readers or side by side writers and servo readers in thegap between the substrate and closure, the gap length can besubstantially reduced. Typical heads have piggybacked readers andwriters, where the writer is formed above each reader. A typical gap is20-35 microns. However, irregularities on the tape may tend to droopinto the gap and create gap erosion. Thus, the smaller the gap is thebetter. The smaller gap enabled herein exhibits fewer wear relatedproblems.

In some embodiments, the second module 304 has a closure, while thefirst and third modules 302, 306 do not have a closure. Where there isno closure, preferably a hard coating is added to the module. Onepreferred coating is diamond-like carbon (DLC).

In the embodiment shown in FIG. 5, the first, second, and third modules302, 304, 306 each have a closure 332, 334, 336, which extends the tapebearing surface of the associated module, thereby effectivelypositioning the read/write elements away from the edge of the tapebearing surface. The closure 332 on the second module 304 can be aceramic closure of a type typically found on tape heads. The closures334, 336 of the first and third modules 302, 306, however, may beshorter than the closure 332 of the second module 304 as measuredparallel to a direction of tape travel over the respective module. Thisenables positioning the modules closer together. One way to produceshorter closures 334, 336 is to lap the standard ceramic closures of thesecond module 304 an additional amount. Another way is to plate ordeposit thin film closures above the elements during thin filmprocessing. For example, a thin film closure of a hard material such asSendust or nickel-iron alloy (e.g., 45/55) can be formed on the module.

With reduced-thickness ceramic or thin film closures 334, 336 or noclosures on the outer modules 302, 306, the write-to-read gap spacingcan be reduced to less than about 1 mm, e.g., about 0.75 mm, or 50% lessthan commonly-used LTO tape head spacing. The open space between themodules 302, 304, 306 can still be set to approximately 0.5 to 0.6 mm,which in some embodiments is ideal for stabilizing tape motion over thesecond module 304.

Depending on tape tension and stiffness, it may be desirable to anglethe tape bearing surfaces of the outer modules relative to the tapebearing surface of the second module. FIG. 6 illustrates an embodimentwhere the modules 302, 304, 306 are in a tangent or nearly tangent(angled) configuration. Particularly, the tape bearing surfaces of theouter modules 302, 306 are about parallel to the tape at the desiredwrap angle α₂ of the second module 304. In other words, the planes ofthe tape bearing surfaces 308, 312 of the outer modules 302, 306 areoriented at about the desired wrap angle α₂ of the tape 315 relative tothe second module 304. The tape will also pop off of the trailing module306 in this embodiment, thereby reducing wear on the elements in thetrailing module 306. These embodiments are particularly useful forwrite-read-write applications. Additional aspects of these embodimentsare similar to those given above.

Typically, the tape wrap angles may be set about midway between theembodiments shown in FIGS. 5 and 6.

FIG. 7 illustrates an embodiment where the modules 302, 304, 306 are inan overwrap configuration. Particularly, the tape bearing surfaces 308,312 of the outer modules 302, 306 are angled slightly more than the tape315 when set at the desired wrap angle α2 relative to the second module304. In this embodiment, the tape does not pop off of the trailingmodule, allowing it to be used for writing or reading.

Accordingly, the leading and middle modules can both perform readingand/or writing functions while the trailing module can read anyjust-written data. Thus, these embodiments are preferred forwrite-read-write, read-write-read, and write-write-read applications. Inthe latter embodiments, closures should be wider than the tape canopiesfor ensuring read capability. The wider closures may require a widergap-to-gap separation. Therefore a preferred embodiment has awrite-read-write configuration, which may use shortened closures thatthus allow closer gap-to-gap separation.

Additional aspects of the embodiments shown in FIGS. 6 and 7 are similarto those given above.

A 32 channel version of a multi-module head 126 may use cables 350having leads on the same or smaller pitch as current 16 channelpiggyback LTO modules, or alternatively the connections on the modulemay be organ-keyboarded for a 50% reduction in cable span. Over-under,writing pair unshielded cables may be used for the writers, which mayhave integrated servo readers.

The outer wrap angles α₁ may be set in the drive, such as by guides ofany type known in the art, such as adjustable rollers, slides, etc. oralternatively by outriggers, which are integral to the head. Forexample, rollers having an offset axis may be used to set the wrapangles. The offset axis creates an orbital arc of rotation, allowingprecise alignment of the wrap angle α₁.

To assemble any of the embodiments described above, conventional u-beamassembly can be used. Accordingly, the mass of the resultant head may bemaintained or even reduced relative to heads of previous generations. Inother approaches, the modules may be constructed as a unitary body.Those skilled in the art, armed with the present teachings, willappreciate that other known methods of manufacturing such heads may beadapted for use in constructing such heads. Moreover, unless otherwisespecified, processes and materials of types known in the art may beadapted for use in various embodiments in conformance with the teachingsherein, as would become apparent to one skilled in the art upon readingthe present disclosure.

In magnetic head structures, it may be desirable to incorporate sensorprotection for a reader and/or writer transducers to provide high wearresistance and adhesion. Moreover, durable cobalt-iron-based(CoFe-based) layers that are part of the pinned and/or free layers inthe magnetic tunnel junctions (MTJ) may improve performance of the tapehead. CoFe-based layers without protection may not be durable and maycorrode when exposed to running magnetic media. Corrosion may adverselyaffect head-medium spacing and head stability, and may degrade headwriting and reading performance. In preferred embodiments, protectionmay be provided by coating the CoFe-based layers of the reader and/orwriter transducers with a durable material.

A preferred coating technology for tape heads with alloys of nickel andiron may be polycrystalline aluminum oxide, according to variousembodiments. CoFe-based layers of the TMR tape heads may benefit fromadditional processing for durable coating adhesion. In preferredembodiments, an improved CoFe-Aluminum (Al) oxide interface may providea durable at least partial polycrystalline coating on the CoFe layer.

FIG. 8A depicts a magnetic head 800 in accordance with variousillustrative embodiments. As an option, the present magnetic head 800may be implemented in conjunction with features from any otherembodiment listed herein, such as those described with reference to theother FIGS. Of course, however, such magnetic head 800 and otherspresented herein may be used in various applications and/or inpermutations, which may or may not be specifically described in theillustrative embodiments listed herein. Further, the magnetic head 800presented herein may be used in any desired environment.

As shown in FIG. 8A according to one approach, the magnetic head 800 mayinclude a module 802. In one embodiment, the magnetic head 800 mayinclude a second and/or third module having a configuration similar oridentical to the module 802. For example, the magnetic head 800 may besimilar to any of the magnetic heads described herein.

In another embodiment, the magnetic head 800 may be configured tooperate with tape media. In yet another embodiment, the magnetic head800 may include a slider that may be used, e.g. with a magnetic disk.

Additionally, the magnetic head 800 may include one or more readtransducers 810 and one or more write transducers 812, as well asconventional layers such as insulating layers, leads, coils, etc. aswould be apparent to one skilled in the art upon reading the presentdescription. In one approach, the one or more read transducers 810 andthe one or more write transducers 812 may be positioned towards themedia facing side 808 of the module 802. In another approach, the one ormore read transducers 810 and the one or more write transducers 812 maybe sandwiched in a gap portion between the closure 804 and the substrate806. In yet another approach, the one or more read transducers 810 andthe one or more write transducers 812 may be present in an array oftransducers extending along the media facing side 808 of the module 802.

The one or more read transducers 810 and the one or more writetransducers 812 may be selected from the group consisting of piggybackread-write transducers, merged read-write transducers, and interleavedread and write transducers, according to various embodiments. Forexample, in one approach the one or more read transducers 810 and theone or more write transducers 812 may be piggyback read-writetransducers, such as those depicted in FIG. 2C.

In another approach, as depicted in FIG. 8A, the one or more readtransducers 810 and the one or more write transducers 812 may be mergedread-write transducers, where an upper sensor shield acts as a pole ofthe writer as well as a sensor shield.

In yet another approach, as depicted in FIG. 8A, the one or more readtransducers 810 and the one or more write transducers 812 may beinterleaved read and write transducers, where the read and writetransducers alternate along the array.

According to another embodiment, the one or more write transducers 812may be flanked by servo read transducers, e.g. as in FIG. 2B.

With continued reference to FIG. 8A, the one or more write transducers812 may include write poles 814 having media facing sides that may berecessed a depth d₁ from a plane 824 extending along the media facingside 808 of the module 802, according to one embodiment.

As shown in FIG. 8A, according to yet another embodiment, one or morewrite transducers 812 may include write poles 814 that maybe becomprised of CoFe-based layers. In other embodiments, the pinned layerand/or free layer in the TMR and GMR of at least one sensor 822 of oneor more read transducers 810 may be comprised of CoFe-based layers. Insome approaches the AFM stabilized magnetic shield 816 may be comprisedof CoFe-based layers.

In continued reference to FIG. 8A, according to one embodiment, amagnetic transducer 810 and/or 812 may have a CoFe layer and an at leastpartially polycrystalline alumina-containing coating 820 on a mediafacing side of the CoFe layer, in which a graded layer 824 comprisingCo, Fe, Al and oxygen (O) may be positioned between thealumina-containing coating 820 and the CoFe layer. In other embodiments,a magnetic transducer 810 and/or 812 may have a CoFe layer and an atleast partially polycrystalline alumina-containing coating 820 on amedia facing side of the CoFe layer, such that CoFe-oxide crystallitesmay be present at the interface region 825 of the CoFe layer and thealumina-containing coating 820 and the CoFe layer.

In various embodiments, an interface region 825 of the CoFe layersand/or graded layer 824 above the CoFe layers may be present at thereader transducer(s) 810 and/or the writer transducer(s) 812. In someapproaches, a graded layer 824 may be present above each of the CoFelayers in the module 802. In other approaches, an interface region 825is present in one or more of the CoFe layers. As shown in the exemplaryembodiment of FIG. 8A, a graded layer 824 is present above the shields816 while interface regions 825 are present in the write poles 814. Inyet another approach, an interface region 825 may be present along thesurface of the CoFe layer and a graded layer 824 is present above theinterface region 825 as shown in FIG. 8B.

In some approaches, the ratio of Co to Al in the graded layer 824 maydecrease from the CoFe layer toward the alumina-containing coating 820.In other embodiments, the alumina-containing coating 820 may becomprised primarily of alumina, where the alumina-containing coatingalso includes cobalt oxide and iron oxide. Particularly, the aluminabased coating 820 has more alumina than any other component, as well assome cobalt oxide and iron oxide. In yet other approaches, the gradedlayer 824 comprising Co, Fe, Al and O may form an interface between theCoFe layer and the alumina-containing coating. In other embodiments, thegraded layer 824 comprising Co, Fe, Al, and oxygen may be partiallycrystalline.

In a preferred embodiment, the alumina-containing coating 820 may beformed on an entire media facing side 808 of the magnetic transducer810, 812, e.g., the media facing side of reader and/or writer portion ofthe head, but not necessarily the media facing side of the entire head800. Moreover, in some approaches the write transducer 812 may becomprised of at least a Co, Fe, and Ni alloy portion. In otherembodiments, the read transducer shield 816 may be comprised of at leasta Co, Fe, and Ni alloy portion.

In some approaches, the thickness of the graded layer 824 comprising Co,Fe, Al, and O may be less than 50 nanometers (nm), but greater than zeronm. Preferably, the graded layer 824 is least 3 nm thick.

Now referring to FIG. 9, a flowchart of a method 900 is shown accordingto one embodiment. The method 900 may be used to create any of thevarious embodiments depicted in FIGS. 1-8, among others, in variousembodiments. Of course, more or less operations than those specificallydescribed in FIG. 9 may be included in method 900, as would beunderstood by one of skill in the art upon reading the presentdescriptions.

Each of the steps of the method 900 may be performed using knowntechniques according to the teachings herein.

Referring to step 902 of FIG. 9, an optional cleaning operation may beperformed prior to a reducing operation. Known cleaning techniques maybe used. Preferred embodiments implement a cleaning operation thatinvolves ion milling, e.g. sputter cleaning, bombarding with ionizedargon, etc. the CoFe-based layer at a low incidence angle of betweenabout 5 and about 20 degrees from normal to the surface of the CoFelayer. The sputtering energy during the milling may be in a range ofabout 250 to about 500 eV. Moreover, the duration of cleaning mayfacilitate fragmentation of the carbonaceous contaminants from thesurface of the CoFe layer. In general, the cleaning step may take 2 toabout 15 minutes.

While the cleaning step 902 removes carbonaceous contaminants, it isalso desirable to remove amorphous Co oxides and/or Fe oxides from theCoFe surface upon which the alumina layer will be formed. FIG. 10A is amagnified view of amorphous Co oxide and Fe oxide at a CoFe surface of acomparative example. The composition of the amorphous Co oxide (CoOx)and Fe oxide (FeOx) is shown in the direction of the arrow of FIG. 10B,which is a Z-contrast image of the structure in FIG. 10A with thespectral scan direction being indicated by the arrow. FIG. 10C is anelectron energy loss spectroscopy (EELS) scan across the layer interfaceshown in FIGS. 10A and 10B. The EELS scan shows the presence of theamorphous CoOx and FeOx before the reducing operation 904, describedbelow.

Referring to step 904 of FIG. 9, following the cleaning operation if itwas performed, a reducing operation is performed. Known reducingprocedures may be used. Preferred embodiments involving ion milling,e.g. sputter cleaning, bombarding with ionized argon, etc. at a highincidence angle of between about 50 and about 70 degrees from normal tothe surface of the CoFe-based layer for at least one of removing anyremaining carbonaceous contaminants and reducing the native oxides onthe surface of the CoFe layer. Moreover, the duration of the reducingoperation is preferably sufficient to remove substantially all of anamorphous native Co and Fe oxides sublayer from the CoFe layer, e.g.,reducing an amorphous CoFeO_(x) layer where x in this and other layersrepresents a potential deviation from an approximately stoichiometricratio. As used herein, “substantially all” of the amorphous native oxidesublayer is at least 95% thereof. In general, the reducing operation maytake 5 to about 20 minutes at a sputtering energy during the milling inthe range of about 250 to about 500 eV.

Because it is expected that the importance of removing all of theamorphous native oxides would not be readily apparent to one skilled inthe art, a comparative example showing the importance of removing all ofthe amorphous native oxides in step 904 is made with reference to FIGS.11A-11C, and an embodiment shown in FIGS. 12A-12C. FIG. 11A is amagnified view of a CoFeAlO_(x) transition layer in which the amorphousnative oxides, CoOx and FeOx, have not been completely removed (yellowarrow). The direction of the arrow of FIG. 11B, which is a Z-contrastimage of the structure in FIG. 11A with the spectral scan directionbeing indicated by the arrow. FIG. 11C is an EELS scan across the layerinterface shown in FIGS. 11A and 11B. The EELS scan shows the presenceof a CoFeAlOx layer, but the interface no longer provides adequatebonding of the alumina coating to the CoFe layer.

Referring to step 906 of FIG. 9, following the reducing operation andprior to forming a layer of at least partially crystalline alumina, anoxidation operation is performed to reoxidize reduced metal oxides.Known oxidation techniques may be used, such as exposure to anoxygen-containing atmosphere, application of a liquid oxidant, etc.According to a preferred approach, the oxidation operation involvesapplying an oxygen plasma for oxidizing the surface of the CoFe layer,e.g., to reoxidize reduced metal oxides. The sputtering energy duringthe ion milling may be in a range of about 250 to about 500 eV. Wherethe layer is CoFe, for example, reoxidation is exothermic and promotesCoFe-oxide recrystallization on the underlying CoFe grains. Newly formedoxide crystallites act as template for subsequent alumina coatingcrystallization. The cleaning and reducing followed by the oxidizingoperations may promote formation of a graded layer between the CoFelayer and the subsequently-formed crystalline alumina layer thereabove.In some embodiments, the oxidation operation may overlap with thereducing operation, e.g., portions of the operations may be performedconcurrently and/or the operations may transition from one to the otherin a continuous manner.

Referring to Step 908 of FIG. 9, forming the alumina coating involvesdepositing alumina, e.g., via sputtering, for forming a layer of atleast partially crystalline alumina on the oxidized surface of the CoFelayer. The at least partially crystalline alumina on the oxidizedsurface of the CoFe layer can be formed at a temperature of betweenabout 20 and about 50 degrees centigrade, which is advantageous wherethe head is sensitive to higher temperatures. Alumina deposition may beperformed in the same chamber as ion milling, without breaking thevacuum. Highly energetic aluminum ions from the reactive sputtering ofalumina in the oxygen atmosphere may initiate thermite-like reactionswith the CoFeOx crystallites and may promote coating crystallization andadhesion with the underlying CoFe layer. Without wishing to be bound byany theory, the inventors believe the thermite-like reaction between theCoFeOx crystallites and the alumina may trigger Co and Fe diffusionupwards toward the alumina coating thereby resulting in formation of agraded layer of Co, Fe, Al, and O. Moreover, the inventors believe thefinal layer of the at least partially crystalline alumina on theoxidized surface of the CoFe layer may include one or more of the cubicallotropes of alumina. The coating may transition to amorphous stateonce the Co and Fe concentrations are reduced to less than 1% and at alevel undetectable by EELS

FIG. 12A is a magnified view of a properly formed, graded, CoFeAlO_(x)graded layer, with substantially no amorphous CoFeO_(x) at the CoFesurface. The composition of the CoFeAlO_(x) graded layer thustransitions from a higher CoFe content at the left side to a higheralumina content on the right side in the direction of the arrow of FIG.12B, which is a Z-contrast image of the structure in FIG. 12A with thespectral scan direction being indicated by the arrow. FIG. 12C is anEELS scan across the layer surface shown in FIGS. 12A and 12B. The EELSscan shows the presence of the graded layer.

According to the tested embodiment, the alumina coating on the CoFelayer with a CoFeAlOx graded layer may be at least partiallypolycrystalline. FIG. 13A is a Transmission Electron Microscopy (TEM)image of the alumina coating on the CoFe layer and the resultingcrystallization. It was also discovered that the depth ofcrystallization of the alumina coating could be as much as 50 nm asshown in FIG. 13A. The alumina layer formed on the CoFeAlOx gradedlayer, sampled from FIG. 13A, exhibits a high degree of crystallinity asshown in the diffractogramm shown in FIG. 13B, where the bright spotsindicate crystallinity.

Furthermore, the tape-based data storage system may include a drivemechanism for passing a magnetic medium over the transducer, and acontroller electrically coupled to the transducer of the magnetic head.According to various approaches, the controller may be electricallycoupled to the magnetic head via a wire, a cable, wirelessly, etc.

It will be clear that the various features of the foregoing systemsand/or methodologies may be combined in any way, creating a plurality ofcombinations from the descriptions presented above.

It will be further appreciated that embodiments of the present inventionmay be provided in the form of a service deployed on behalf of acustomer.

The inventive concepts disclosed herein have been presented by way ofexample to illustrate the myriad features thereof in a plurality ofillustrative scenarios, embodiments, and/or implementations. It shouldbe appreciated that the concepts generally disclosed are to beconsidered as modular, and may be implemented in any combination,permutation, or synthesis thereof. In addition, any modification,alteration, or equivalent of the presently disclosed features,functions, and concepts that would be appreciated by a person havingordinary skill in the art upon reading the instant descriptions shouldalso be considered within the scope of this disclosure.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. Thus, the breadth and scope of an embodiment of the presentinvention should not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

What is claimed is:
 1. A method, comprising: performing a reducing operation for reducing a native oxide along a surface of a CoFe layer of a magnetic transducer; after performing the reducing operation, performing an oxidation operation for oxidizing the surface of the CoFe layer; and after performing the oxidation operation, forming a layer of at least partially crystalline alumina on the oxidized surface of the CoFe layer.
 2. The method as recited in claim 1, wherein the oxidized surface of the CoFe layer has CoFe-oxide crystallites therein.
 3. The method as recited in claim 1, further comprising, performing a cleaning operation prior to performing the reducing operation, wherein the cleaning operation comprises argon sputtering at an angle of between 5 and 20 degrees from normal to the surface of the CoFe layer for removing carbonaceous contaminants from the surface of the CoFe layer.
 4. The method as recited in claim 3, wherein a sputtering energy of the argon sputtering is in a range of about 250 to about 500 eV.
 5. The method as recited in claim 1, wherein the reducing operation comprising argon sputtering at an angle of between 50 and 70 degrees from normal to the surface of the CoFe layer for at least one of removing carbonaceous contaminants and reducing the native oxides on the surface of the CoFe layer.
 6. The method as recited in claim 5, wherein a sputtering energy of the argon sputtering is in a range of about 250 to about 500 eV, wherein a duration of the reducing is sufficient to remove substantially all of an amorphous native oxide sublayer from the CoFe layer where “substantially all” of the amorphous native oxide sublayer is at least 95% thereof.
 7. The method as recited in claim 1, wherein the oxidation operation comprises applying oxygen plasma for oxidizing the surface of the CoFe layer.
 8. The method as recited in claim 1, wherein portions of the oxidation operation and the reducing operation are performed concurrently.
 9. The method as recited in claim 1, wherein forming the layer of at least partially crystalline alumina on the oxidized surface of the CoFe layer comprises sputtering alumina on the oxidized surface of the CoFe layer.
 10. The method as recited in claim 1, wherein the at least partially crystalline alumina on the oxidized surface of the CoFe layer can be formed at a temperature of between about 20 and about 50 degrees centigrade.
 11. The method as recited in claim 1, wherein the layer of at least partially crystalline alumina on the oxidized surface of the CoFe layer is a final layer comprising at least one type of a cubic allotrope of alumina. 